Package Design Engineer - RENESAS SEMICONDUCTOR

Responsibilities:
* Research on Package solution, create and validate new package design concepts.
* Collaborate with suppliers and related in development of new package.
* Create material specifications, design review and define overall package performance and specifications.
* Liase with parent company to assist and support for new package transfer and development.
* Innovate new package design for any new business opportunity.
* Write proposals for new package development projects.
* Assists in cost reduction activities related to package design.
* Create lead frame and package drawings with AutoCad system.

Requirements:
* Bachelor's Degree, Post Graduate Diploma or Professional Degree in Engineering (Material Science), Engineering (Mechanical) or its equivalent.
* Minimum 2 year(s) of working experience in the related field is required for this position.
* Good communication in English and Bahasa Malaysia.
* Able communicate in Japanese is preferred.
* Knowledge in AutoCad is an added advantage.

Interested applicants are encouraged to submit written application complete with curriculum vitae, contact telephone number, etc together with a recent passport-sized photograph (n.r) or fax to:

The Human Resource Department
RENESAS SEMICONDUCTOR (MALAYSIA) SDN. BHD.
Bayan Lepas Free Industrial Zone
11900 Bayan Lepas, Penang

Tel: 04-6438121 ext: 2204, 2205
Fax: 04-6434190

Closing date : 13 November 2007